Lead Package Assembly Integrator
$218,000–$317,000 year
HybridMountain View Santa Clara County, California, United States
Job Summary
Develop end-to-end 3D package assembly, test, and fiber-attach processes for Lightmatter products, ensuring robust high yields while meeting performance and reliability goals by collaborating with foundry and OSAT partners. Define test chip requirements and manage test chip design required for 3D package process development. Develop and validate design rules for a high-yielding assembly process, covering assembly/test, backend/RDL, silicon/package interaction, substrate, thermal/mechanical solutions, and fiber attach. Plan and execute design of experiments, manage data, and perform analysis to gain insights into assembly process and design interactions. Perform analysis to identify key reliability risks under product use conditions and drive appropriate design and materials solutions to improve product mechanical integrity. Summarize and communicate to key stakeholders across Lightmatter, suppliers, and customers as required. Write reports and document methodologies.
Required Qualifications
- MS or PhD in Mechanical Engineering, Material Science, or related engineering field
- Experience in wafer scale packaging assembly process development
- Knowledge of 2D/3D packaging technologies, materials, and equipment requirements
- Proven ability to define requirements for test chip and assembly test vehicles
- Understanding of photonics packaging requirements including various fiber attach methods
- Experience with advanced packaging technologies, including thermal, mechanical, and reliability factors
- Capacity to comply with the federally mandated requirements of U.S. export control laws
Desired Qualifications
- Excellent communication skills, with the ability to convey complex technical concepts to both technical and non-technical stakeholders
- Strong project ownership, with a history of driving results independently and with minimal supervision
- Proven track record of developing creative solutions for complex technical challenges
- Experience in thermal and mechanical modeling and coding for data analysis
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