Intel Process Integration Engineer - (FE)
$103,730–$198,820 year
On-site · Phoenix, Arizona, United States or Hillsboro, Oregon, United States
Job Summary
Process Flow Development for new technology nodes across front-end steps (lithography, etch, deposition, diffusion, wet clean, CMP, metrology) with cross-team coordination to establish process windows and integration schemes. Focus on Yield and Defect Reduction through root cause analysis using statistical tools (SPC, DOE, FMEA) and driving corrective actions to improve yield and cycle time. Optimize Device Performance by tuning process conditions to meet electrical targets, improving CD and overlay, and film thickness in collaboration with device engineers. Implement Process Control and Monitoring plans and support Technology Transfer from R&D to high-volume manufacturing (HVM), including SOP documentation. Prepare for cross-functional work with Device, Equipment, Yield, Reliability, and Design teams. Preferred qualifications include JMP/MATLAB/scripting (Python, JSL, TCL), knowledge of CMOS/FinFET/GAA, VLSI fabrication and testing experience, basic fabrication instrumentation, and strong data analysis and DOE/D charting skills. This role requires on-site presence at U.S. locations in Hillsboro, OR and Phoenix, AZ.
Required Qualifications
- PhD degree in Electrical Engineering, Physics, Applied Physics, Optics, Material Science, Chemical Engineering, Mechanical Engineering, or related discipline
- At least one of the following: 6+ months experience in semiconductor device fabrication or nanotechnology; electrical characterization of transistors or other semiconductor devices; clean room process development
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