IC package design engineer
On-siteTel Aviv, Tel Aviv, Israel or Caesarea, Haifa, Israel
Job Summary
Lead package design tasks, planning, and schedule execution from concept through implementation. Optimize package pinouts, stack-ups, power distribution, and high-speed routing while balancing performance and manufacturability. Collaborate with silicon floor planning, signal integrity, and power integrity teams to ensure design quality, and work closely with layout editors to deliver designs aligned with interface requirements. Enhance design methodologies and partner with vendors to improve product quality and efficiency. Drive innovation in package solutions for Cisco's next-generation ASICs within the Silicon One initiative in Armenia.
Required Qualifications
- Bachelor's or Master's degree in Electrical Engineering or a related field
- Strong understanding of high-speed signal design, power distribution networks (PDN), and PCB design
- Experience with industry-standard EDA tools for layout and design
Desired Qualifications
- Experience in ASIC package design, including pinout optimization and high-speed routing
- Knowledge of silicon floor planning, SI, and PI considerations
- Proven ability to lead design improvements and coordinate with stakeholders
- Firsthand experience with testing and measurement equipment (oscilloscopes, TDR/VNA analyzers)
- Excellent verbal and written communication skills in English
- Scripting experience (Python, Perl, TCL, shell programming)
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