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UbiquitiPosted 1 month ago

Hardware Engineer (Enterprise Switch)

On-siteTaipei, Taiwan, Taiwan

Full TimeSenior LevelBachelors DegreeLarge

Job Summary

Lead hardware circuit design, schematic capture, and layout review for next-generation, high-density, and high-throughput networking platforms. Evaluate and integrate advanced switching architectures, management subsystems, and cutting-edge high-speed interconnect technologies. Drive hardware architecture design, system bring-up, high-speed signal integrity validation, and root-cause failure analysis. Partner with mechanical, thermal, and power engineering teams to address challenges related to high power density, thermal dissipation, and system-level reliability. Own BOM structure and support factory deployment to ensure seamless transition of high-layer-count PCBAs from NPI to mass production. Collaborate with cross-functional software, firmware, QA, and compliance teams throughout the entire product lifecycle.

Required Qualifications

  • Bachelor's degree or above in Electrical Engineering or a related discipline
  • 5+ years of hands-on experience in high-complexity system-level hardware design, ideally focused on enterprise-grade networking or high-performance infrastructure equipment
  • Deep technical understanding of high-speed Ethernet design, high-speed differential signals (advanced SerDes, PCIe, multi-gigabit/ultra-high-speed interfaces), and high-density PCB design rules
  • Practical experience with complex power delivery networks (PDN), power integrity, and high-reliability system architectures (e.g., redundant power systems, hot-swappable modules)
  • Hands-on proficiency in hardware validation, signal integrity measurement, debugging, and failure analysis
  • Familiarity with international compliance and environmental standards (EMC/EMI, ESD, Safety)
  • Proficiency with standard EDA tools (OrCAD Capture, Cadence Allegro, or equivalent)

Desired Qualifications

  • Experience with advanced system management architectures (e.g., remote management controllers and out-of-band management protocols)
  • Knowledge of high-power density board design, advanced chassis thermal solutions, or modular architecture

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