Group Leader – Wet Etching (TGV & Cu)

Group Leader – Wet Etching (TGV & Cu) responsible for leading development, optimization, qualification, and manufacturing support of wet etching processes for TGV and copper etching in semiconductor glass-panel packaging; focuses on etch profile control, dimensional accuracy, defect reduction, process stability, and high manufacturing yield; leads cross-functional teams, drives DOE, process characterization, and recipe optimization; mentors engineers/technicians and ensures compatibility with cleaning, lithography, plating, and wet-chemistry, with emphasis on pilot-line and scale-up activities and qualification of equipment/tools.