Front End Central Product Integration (FE cPIE) Principal Engineer
On-siteTaoyuan, Taiwan, Taiwan or Taichung, Taiwan, Taiwan
Job Summary
Front End Central Product Integration, CPIE (Central Product Integration Engineering) HBM (High Bandwidth Memory) PI Principal Engineer/Senior Manager at Micron Technology, Inc, provides leadership to the global Micron network to drive HBM product yield, quality improvement, and new product introduction (NPI) through technical expertise, business process management and project execution. Responsibilities include strategic leadership with FAB and business partners to achieve objectives, development of tools and roadmaps, and fostering innovation. Tactical leadership covers metrics reviews, program reviews, resource alignment, and clear communications with business partners. Emphasis on AI-enabled tooling, process integration, and cross-functional collaboration with teams in Japan, Taiwan, Singapore and the US. Requires travel to Micron sites (20-50%), strong ownership, problem-solving, cross-cultural collaboration, and the ability to drive results while developing team members.
Required Qualifications
- Bachelor's/Master's/PhD in EE, Materials Engineering, Materials Science, Physics or Chemical Engineering
- 7+ years of experience in a process-related role in the semiconductor industry
- Ability to apply baseline digital fluency and AI literacy to use AI-enabled tools for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes
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