FE ASSY DIE BOND PROCESS TECHNICIAN
On-siteKuala Lumpur, Kuala Lumpur, Malaysia
Kuala Lumpur, Kuala Lumpur, MalaysiaOn-siteFull TimeEnterprise
Full TimeEnterprise
Job Summary
Perform die bond process tasks on quality hold material and assist in resolving DB-related issues to minimize production downtime. Collaborate with equipment and manufacturing teams to improve DB processes and techniques. This role requires a diploma or above in engineering with working experience in the DB process, strong attention to detail, and technical troubleshooting skills. NXP Semiconductors enables a smarter, safer, and more sustainable world through innovation in secure connectivity solutions for automotive, industrial, IoT, and mobile markets.
Required Qualifications
- Diploma or above in Engineering or a related field
Desired Qualifications
- Working experience with DB process
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