External Package Innovation Engineer
On-siteKuala Lumpur, Kuala Lumpur, Malaysia
Job Summary
Lead OSAT-wide and cross-site initiatives by defining development templates, deploying Best Known Methods, and driving technology roadmaps for external package innovation. Own project governance through stoplight reporting and regular reviews while supporting NPI and NTI projects at external factories. Ensure OSAT compliance with required documentation, align on Subject Matter Expert assignments, and resolve technical issues across time zones to enable safe production launches. Collaborate with cross-functional teams including designers, materials engineers, and OSAT partners to execute joint site selection and sourcing strategies.
Required Qualifications
- Strong experience in semiconductor packaging
- Handson assembly process experience
- Pre-assembly experience
- Wire bonding experience
- Proven ability to manage cross-site, cross-functional projects
- Solid understanding of NPI/NTI development flows
- Excellent stakeholder management skills
- Excellent communication skills
- Ability to drive standardization
- Ability to drive governance
- Ability to drive technical problem-solving
Desired Qualifications
- Previous exposure to OSAT ecosystem
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