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HCTZ1 month ago

Engr Prin, Package Development (NPI Mold Engineer)

On-site · Seremban, Negeri Sembilan, Malaysia

Type
Full Time
Level
Mid Level
Education
Not Specified
Company size
Unknown
Industry
Software

Job Summary

Role involves developing discrete and power module assembly processes, aligning R&D with manufacturing, and establishing process POR through setup and characterization.

Required Qualifications

  • Experience in discrete and power module assembly process
  • Familiarity with R&D and manufacturing alignment
  • Ability to establish process POR
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HCTZ

Engr Prin, Package Development (NPI Mold Engineer)

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