Engineer, packaging engineering
On-site · Hsinchu, Taiwan, Taiwan
Job Summary
Engineer, packaging engineering responsible for defining, developing, and qualifying new wire-bonded and flip-chip semiconductor packages with subcontractors; manage next-generation packaging technologies with internal R&D teams and external technology partners; collaborate with business units to anticipate future product packaging needs; drive yield improvements and efficiency in subcontractor operations; oversee the full life cycle of packages from path finding to qualification and high-volume manufacturing; requires strong communication and analytical skills and a background in electrical/chemical/material science/physics engineering.
Required Qualifications
- Master degree in Electrical Engineering, Chemical Engineering, Material Science, Physics, or a related engineering discipline
- Excellent communication and interpersonal skills
- Strong problem-solving and analytical skills
- Knowledge of IC fabrication and packaging is plus
- This is an entry-level position; no prior work experience is needed
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