Engineer, packaging engineering
On-site · Shanghai, Shanghai, China
Job Summary
Defines, develops and qualifies new wire-bonded as well as flip-chip semiconductor packages with subcontractors and maintains quality of existing packages. Manages next-generation packaging technologies with internal R&D teams and external technology partners. Works closely with business units to understand future product needs and suggest packaging solutions. Drives yield improvement and greater efficiency of subcontractors’ operations. Manages the entire life cycle of packages from path finding to qualification and high-volume manufacturing. Requires a Master degree in Electrical Engineering, Chemical Engineering, Material Science, Physics, or a related engineering discipline; excellent communication and analytical skills are highly desirable; knowledge of IC fabrication and packaging is a plus. This is an entry-level position with no prior work experience needed.
Required Qualifications
- Master degree in Electrical Engineering, Chemical Engineering, Material Science, Physics, or a related engineering discipline
- Excellent communication and interpersonal skills
- Strong problem-solving and analytical skills
- Knowledge of IC fabrication and packaging is a plus
- This is an entry-level position; no prior work experience is needed
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