Engineer II

Maintain and improve Die Attach / Die Bond equipment to ensure smooth production, high machine uptime, and product quality in a semiconductor manufacturing environment. Support and maintain machines, troubleshoot and resolve equipment issues to minimize downtime, and perform preventive maintenance and inspections. Monitor equipment performance, drive improvement activities, and support machine setup, qualification, and new product introductions. Work closely with Production, Quality, and Process Engineering teams to achieve targets, analyze equipment data, and implement corrective actions while ensuring compliance with safety and manufacturing procedures. Bachelor's degree in a relevant engineering field and 2–5 years of semiconductor manufacturing experience are required, with preferred familiarity with Die Attach / Die Bond equipment and continuous improvement tools.