Engineer, HIG HBM
On-site · Singapore, Singapore
Job Summary
Reliability-focused engineering role developing and executing reliability stress/test flows and plans for HBM products, driving qualification management and issue resolution with Global Quality; contribute to reducing extrinsic and intrinsic reliability failures through optimized manufacturing test flows, root cause analysis (EFA/PFA), and cross-functional collaboration with Fab, HBM Technology Development, System Development, and Quality/Reliability teams. Emphasizes project management, risk assessment, process-conversion recommendations to improve yield and cost, and strong emphasis on data analysis, scripting (Python/JMP), and thorough communication to ensure timely delivery of high-reliability product improvements.
Required Qualifications
- Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field
- Coursework or internship experience in semiconductor devices, circuit design, or product validation is a plus
- Familiarity with CMOS technology, DRAM architecture, and basic device physics
- Exposure to data analysis, statistics, and scripting tools such as Python or JMP
- Strong attention to detail and a commitment to quality
- Ability to work effectively in team-based projects
- Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment
- Responsible and accountable, with a professional work ethic and ownership of assigned tasks
- Clear and effective communication skills in written and spoken English
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