ENGINEER, APTD Wafer Thinning / CMP process
On-site · Taichung, Taiwan, Taiwan
Job Summary
Engineer in APTD Wafer Thinning / CMP process at Micron Technology. Drive improvements in wafer thinning and CMP process performance, coordinate experiments for technology development and yield improvement, assist advanced packaging R&D (2.5D/3D), support on-site project execution as technical advisor, troubleshoot complex process engineering issues, and generate documentation for presentations and technical reports. Engage in cross-team process development, coordinate mechanical characterization and testing for packaging development globally (US, Japan, Singapore), and provide recommendations for test structures and vehicle designs to meet specifications and roadmaps.
Required Qualifications
- More than 2 years experience in semiconductor related industry
- Master degree or higher in Chemistry, Physics, Materials, engineering science related fields
- Experience in Si grinding, Edge Trim, Si CMP, Cu CMP, Oxide CMP technologies
- Understanding of CMP metrics - Planarity, RR, selectivity, dishing, erosion, surface roughness, defectivity
- Innovative and integration mindset with independent thinking
- Good team player with high motivation
- Fluent English and Chinese communication
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