ENGINEER, APTD FILM process
On-site · Taichung, Taiwan, Taiwan
Job Summary
Engineer, APTD Film process responsible for driving HBM process development and yield improvement in FILMs processes; assist advanced packaging technology research and development (chip stacking, 2.5D or 3D); support on-site execution and act as technical consultant; troubleshoot a variety of complex problems and perform root cause analysis; generate internal and external documentation for presentations and technical reports; coordinate mechanical characterization for advanced packaging development globally (US, Japan, Singapore); provide recommendations for test structure and test vehicle design for material property evaluation; review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps.
Required Qualifications
- Master's degree in Chemistry/Physics/Materials/Engineering science or related fields
- At least 2 years of experience in FILMs (CVD, PVD) in related industry
- Solid understanding of thin film deposition principles
- Understanding of process characteristics – film uniformity, stress, adhesion, step coverage, defect behavior
- Hands-on experience with CVD/PVD production tools (e.g., AMAT, LAM, TEL) is a plus
- Innovative/integration mindset with independent thinking
- Good teamwork and motivation
- Fluent communication in English and Chinese
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