Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
On-site · Singapore, Singapore
Job Summary
Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking. Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity. Evaluate and promote new equipment and materials to enhance process capabilities, and ensure defense coverage through process, measurement, inspection, and testing. Collaborate with internal and external stakeholders to execute technology development strategies, integrating manufacturing processes for optimal performance and quality control. Candidates should have a Bachelor’s or advanced degree in Engineering or Science, strong analytical skills, and effective communication abilities.
Required Qualifications
- Bachelor’s or advanced degree in Engineering or Science
- Strong analytical, logical, and critical thinking skills
- Effective communicator, able to collaborate across all levels
- Growth mindset with a passion for continuous learning
Desired Qualifications
- Internship or experience in the semiconductor industry is a plus
- Demonstrated leadership and a track record of impact are highly desirable
- Interest in and knowledge of the semiconductor industry and Micron is preferred
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred
- Experience with Visual Basic for automation and tool integration is preferred
Additional Requirements
- Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards
- Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron
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