ENGINEER, APTD Bonding process
On-site · Taichung, Taiwan, Taiwan
Job Summary
Engineer role focused on HBM bonding process development and yield improvement in WSS processes, with involvement in advanced packaging R&D (chip stacking, 2.5D/3D), on-site project execution as a technical consultant, and root-cause analysis of complex process engineering issues. Responsibilities include materials characterization coordination, data review/presentation, collaboration with cross-functional teams and suppliers (packaging materials), and design/validation of test structures and vehicles for material property evaluation. Requires a Master’s degree or higher in Chemistry, Physics, Materials, or related engineering fields, at least 2 years bonding-related experience, and knowledge of TBDB, Hybrid Bonding, Fusion/Direct wafer bonding; bilingual English/Chinese; hands-on bonding tool experience preferred.
Required Qualifications
- Degree/Major: Master or higher in Chemistry, Physics, Materials, Engineering science related fields
- Must have at least 2 years of bonding-related experience
- Solid understanding of WSS/Bond advanced technologies: Temporary bonding/debonding (TBDB); Hybrid Bonding (Cu/dielectric); Fusion Bonding / Direct wafer bonding
- Knowledge of bonding mechanisms - surface activation, adhesion physics, interfacial energy, thermo-compression and plasma-assisted bonding
- Hands-on experience with bonding-related tools (SUSS/EVG/TEL) is a plus
- Independent thinking with an innovative/integration mindset
- Good team player with motivation
- Fluent communication in English and Chinese
- Master/Major: Chemistry/Physics/Materials/Engineering science
- PhD is a plus
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