E/E Eng.(嵌入式硬件长春)
On-siteChangchun, Jilin, China
Job Summary
Lead hardware R&D for nitrogen-oxygen, MEMS pressure sensors, and two-wheeler ECU products, covering requirement analysis, schematic design, component selection, and output of mass-production compliant documentation. Drive PCB layout reviews, coordinate routing, and enforce EMC/EMI, signal integrity, and power integrity standards while ensuring manufacturability and testability. Execute hardware prototyping, debugging, and testing including single-board and system integration, resolving R&D and trial production faults to generate reports and corrective plans. Collaborate with embedded software and structural engineers for system integration, advancing products from prototype to small-batch trial production and mass production.
Required Qualifications
- 本科及以上学历
- 电子、电力电子或通信工程等相关专业
- 精通C语言
- 5年及以上嵌入式硬件研发经验
- 熟练掌握嵌入式硬件核心电路设计和验证
- 具备独立设计单板硬件的能力
- 精通硬件设计工具,如 Zuken、Altium Designer、Cadence等
- 熟悉多层板设计流程
- 熟悉各类嵌入式元器件选型
- 掌握硬件调试方法与工具使用
- 具备良好的文档编写能力
Desired Qualifications
- 电源电路(LDO/DCDC/PMU)
- MCU/ARM/FPGA最小系统
- 接口电路UART/I2C/SPI/CAN/LIN/Ethernet/USB
- 模拟电路
- 了解元器件的规格参数、可靠性、供应链情况
- 能根据产品需求做高性价比选型
- 能独立定位并解决硬件上电、通信、电源等各类故障
- 能规范输出原理图、BOM、设计说明、测试报告等技术文档
- 具有良好的学习能力和分析解决问题能力
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