Dry Etch Process Develop Engineer
$107,000–$182,000 year
On-site · Albany, New York, United States or Boise, Idaho, United States
Job Summary
Develop, qualify, and sustain dry etch (plasma) unit processes for advanced memory technologies (e.g., dielectric, conductor, and hardmask etch). Optimize critical process metrics including CD control, etch profile/anisotropy, selectivity, microloading, uniformity, and line edge/line width roughness. Drive defect reduction and yield improvement using inline/out-of-line metrology, DOEs, SPC, and statistical data analysis. Perform root-cause analysis and implement corrective actions for process excursions, tool health issues, and integration-related failures. Partner with equipment vendors on chamber matching, hardware and recipe development, new capability evaluations, and cost-of-ownership improvements. Document process baselines, change controls, and learning; communicate results and support technology transfer to high-volume manufacturing.
Required Qualifications
- M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or related engineering/technical field relevant to plasma processing and semiconductor manufacturing
- B.S. with 3+ years of semiconductor processing experience with emphasis on dry etch/plasma etch will also be considered
- Experience in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis
- Working knowledge of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity)
- Ability to collaborate effectively across cross-functional technical teams and communicate results clearly
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