Director of Field Applications Engineering- Europe and APAC
RemoteUnited Kingdom
Job Summary
Lead a distributed team of senior Field Applications Engineers across Europe and Asia-Pacific, driving technical adoption and securing high-value design wins for next-generation fabric interconnect silicon IP. Manage recruitment, mentorship, and regional goals while acting as the escalation point for critical customer issues and overseeing proof-of-concepts. Deliver technical keynotes to C-level executives and funnel customer requirements to internal R&D to shape the future IP roadmap. Create application notes and training collateral to enable ecosystems, with up to 30-40% international travel required for a remote role based in the EU or UK.
Required Qualifications
- Bachelor's degree in Electrical Engineering, Computer Engineering, or a related STEM field
- 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support)
- 10+ years in the semiconductor, silicon IP, or high-performance networking sectors
- Deep understanding of Network-on-Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics
- Familiarity with front-end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens)
- Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements
- Exceptional English verbal and written communication skills
- Proven experience managing teams and clients across diverse cultures in Europe and Asia
- Self-motivated style suited for a fast-paced, early-stage startup environment
Desired Qualifications
- Master's degree or PhD in Electrical or Computer Engineering
- Prior experience working in a fast-growing, venture-backed silicon IP startup
- Existing technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC
- Additional language skills relevant to the covered regions (e.g., Mandarin, Japanese, Korean, German)
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