Dielectric and Polymer Materials Engineer
$100,000–$150,000 year
On-siteCovington, Georgia, United States
Job Summary
Characterize dielectric film properties (electrical, thermal, mechanical) and correlate to process and reliability outcomes. Select, qualify, and support process window definition of advanced packaging dielectrics for RDL build-up. Support determination of optimal processing conditions across fabrication teams. Evaluate emerging dielectric materials and technologies for roadmap fit. Develop and optimize cure, lamination, or photopatterning sequences for novel dielectric layers. Investigate and resolve adhesion, delamination, cracking, or CTE-mismatch failures through materials and process analysis. Run reliability qualification testing (HAST, TCT) and interpret dielectric-driven failure mechanisms. This role requires both materials science depth and process integration awareness. Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing.
Required Qualifications
- Hands-on experience evaluating, processing and/or successful qualification of two or more advanced packaging dielectrics, example ABF, PBO, PSPI, PID, Solder resist or BCB
- Deep knowledge of dielectric patterning approaches: photoexposure, develop, and cure sequences for photosensitive materials; or lamination and laser drill for non-photosensitive films
- Extensive experience with film characterization: ellipsometry, FTIR, TGA/DSC, profilometry, nanoindentation
- Understanding of dielectric-to-metal adhesion, CTE mismatch, and stress management in multilayer stacks
- Experience with electrical characterization of dielectric films (Dk, Df, leakage, breakdown voltage)
- Ability to execute reliability testing per JEDEC standards (HAST, uHAST, TCT) and interpret failure mechanisms
- Fluent in English
Desired Qualifications
- Direct experience with glass core or glass interposer dielectric process integration
- Deep Familiarity with low-Dk/low-Df materials targeting high-frequency and AI/HPC applications
- Knowledge of plasma-enhanced CVD or PVD inorganic dielectrics for thin-film packaging
- Experience with CMP of dielectric films in damascene or hybrid bonding contexts
- Background in failure analysis of dielectric delamination, cracking, or via integrity (FIB-SEM, TEM, laminography)
- Familiarity with JEDEC and IPC qualification standards for substrate dielectrics
- Track record of material supplier engagement and collaborative efforts for material testing and qualification
- Publication record or patent activity in dielectric materials for packaging is a plus
- Ph.D. in Materials Science, Polymer Science, Chemical Engineering, Electrical Engineering, or related field preferred
- M.S. with 3+ years of relevant industry or research experience considered
- proficiency in Korean
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