Die / Clip Attach Technical Expert
On-siteCabuyao, Calabarzon, Philippines or Seremban, Negeri Sembilan, Malaysia
Job Summary
Develop and drive equipment strategies for semiconductor manufacturing processes including Pre-Assembly, Die Bond, Wire Bond, and Mold. Evaluate new technologies, lead qualification projects, and resolve complex technical issues to enhance productivity, quality, and cost efficiency. Solve chronic manufacturing challenges by developing process standards, conducting cross-site benchmarking, and implementing best practices across international teams. Lead technical projects involving R&D, production, and quality stakeholders while preparing capability studies and roadmaps. Stay updated on industry solutions and build strong networks with suppliers to support future package R&D roadmaps.
Required Qualifications
- Bachelor's or master's degree in engineering or a related discipline
- Minimum 10 years of experience in semiconductor manufacturing and process engineering
- Strong technical expertise in process and/or equipment engineering within semiconductor assembly operations
- Proven experience in equipment selection, qualification, optimization, and technology introduction
- Strong analytical thinking with excellent troubleshooting and problem-solving capabilities
- Ability to work independently and drive improvement initiatives proactively
- Strong communication and presentation skills with the ability to engage stakeholders effectively
- Experience leading technical and cross-functional projects in a manufacturing environment
- Strong leadership, influencing, and stakeholder management skills
- Detail-oriented with a structured and systematic working approach
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