Die Attach Equipment Technician
On-site · Kuala Lumpur, Kuala Lumpur, Malaysia
Job Summary
The Die Attach Equipment Technician is responsible for maintaining and repairing Die Attach integrated lines, which include loader, unloader, die attach, AOI, and reflow oven equipment. The technician must possess experience with Die Attach equipment, particularly Datacon 8800 FC QUANTUM, and manage equipment setup or conversion for product changes. Key responsibilities include sustaining equipment performance, improving overall equipment efficiency (OEE), and solving quality issues. Qualifications include a diploma in Electrical & Electronics or Mechanical Engineering and a minimum of 5 years of relevant experience in semiconductor assembly.
Required Qualifications
- Diploma in Electrical & Electronics or Mechanical and Engineering discipline
- Minimum 5 years of relevant working experience in Die Attach equipment
- Experience working on Die Attach equipment such as Datacon 8800 FC QUANTUM
- Ability to maintain and repair Die Attach integrated line including loader, unloader, die attach, AOI and reflow oven equipment
- Ability to work independently to identify and sustain critical spare and tooling
- Ability to work long hours and shifts
- Adherence to NXP Total Quality Mindset and Safety Awareness
- Adherence to NXP core values: Trust and Respect, Collaboration, Ownership, Expertise, Innovation, and Growth
Desired Qualifications
- Experience in semiconductor assembly and applied statistics
- Good technical skills on Front and Back End assembly equipment
- Strong interpersonal and communication skills
- Good decision making / problem solving skills
- Familiar with production environment & possesses process handling knowledge (Semiconductor)
Additional Requirements
- Must adhere to NXP Total Quality Mindset and Safety Awareness
- Must be disciplined and willing to work long hours and shifts
- NXP employees must apply via the internal career page
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