Device Engineering Intern (Jan-Jun 2027)
On-siteWoodlands, Singapore
Job Summary
Characterize RRAM bitcells using wafer-level and bench measurements, perform SPICE simulations and model validation, and analyze electrical data including switching performance, endurance, and retention. Correlate silicon measurement results with simulation data to support device debugging, data analysis, and technical reporting. Work closely with device engineers on next-generation embedded non-volatile memory applications while adhering to all Environmental, Health, Safety & Security requirements. This 16–24 week credit-bearing internship commencing January 2027 offers hands-on experience in advanced semiconductor memory technology within GlobalFoundries' 55nm RRAM development team.
Required Qualifications
- Actively pursuing a Bachelor's, Master's, or PhD in Electrical/Electronic Engineering, Microelectronics, Physics, or related fields
- Must be in good academic standing
- Ability to work at least 40 hours per week during the internship
- Available for a 16–24 week credit-bearing internship commencing January 2027
- Must be able to lift 50 lbs
Desired Qualifications
- Prior related internship or co-op experience
- Basic knowledge of semiconductor devices and circuits
- Familiarity with SPICE simulation tools and data analysis
- Programming skills (Python or similar) are advantageous
- Strong analytical and problem-solving skills
Hiring someone like this?
Get your role in front of qualified candidates on Sorce.