CUF TD Module Engineer

Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions. Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows. Establishes material specifications for contract assemblers and vendors, interfaces with supplier quality and procurement to meet material quality and vendor performance via strict adherence to process specs and product qualification methods. Develops new techniques and acceleration methods, tools, and quality screens to ensure early identification of potential problems with packaging quality and reliability. Sets reliability requirements to meet customer needs and influences design, material selection and process development. Leads efforts towards innovating and continuously improving equipment and processes using experimental design and statistical methods. Provides consultation on packaging problems, responds to customer requests, delivers standardization in product qualification and manufacturing quality systems, and collaborates with packaging technology development and partner engineering groups on process maturity for products toward milestones. Role requires on-site presence in Kulim, Malaysia.