CUF TD Module Engineer
On-siteKulim, Kedah, Malaysia
Job Summary
Develop assembly processes and equipment for CUF modules while optimizing manufacturing efficiency to meet quality, reliability, cost, and yield requirements. Design process specifications using experimental design and data analysis, then document improvements through white papers. Maintain equipment to evaluate silicon and package technologies under simulated field conditions such as heat, humidity, and dynamic forces. Establish material specifications for contract assemblers and vendors, ensuring adherence to qualification methods. Develop acceleration methods and quality screens to identify packaging problems early, setting reliability requirements to influence design and material selection. Lead efforts to innovate equipment and processes using statistical methods, providing consultation on packaging improvements and responding to customer requests. Deliver standardization in product qualification and manufacturing quality systems while engaging with partner engineering groups on technology maturity.
Required Qualifications
- MSc/PhD degree in Mechanical Engineering/Material Engineering/Electrical Engineering/Chemical Engineering/Physics with focus on thermal/fluid/packaging assembly process engineering or related engineering background
- at least 3 years of working experience
- Fundamental understanding of semiconductor assembly equipment and processes
- on-site presence
Desired Qualifications
- Bachelor's Degree with strong relevant experience
- Developing new processes through hardware /toolset development
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