Component Engineering Technical Leader

Develop and lead the system thermal technology roadmap in partnership with microelectronics packaging and cooling solution suppliers to meet Cisco product needs. Derive tradeoffs in thermal performance from experimental data and establish parameters for thermal design/testing while integrating circuit simulation with system-level cooling technologies. Develop quality strategies for liquid cooling manufacturing processes and create test plans to ensure mechanical adaptability of cooling solutions. Engage with external vendors on design, test, and production, and contribute to analytical models using Computational Fluid Dynamics tools. Coordinate circuit packaging technologies and component reliability analysis, publishing case studies and influencing industry standards. Requires BS in Mechanical/Thermal or Chemical Engineering with 10+ years in thermal solutions for electronic devices.