Business Development Manager- Emerging Growth Marketing
On-siteDurham, North Carolina, United States
Job Summary
Identify and develop new business opportunities for SiC in advanced packaging applications across AI accelerators, HPC, co-packaged optics, quantum computing, and AR/VR platforms. Build executive-level relationships with leading chip designers, foundries, OSATs, EDA players, and optical-module vendors to secure design-ins, joint development programs, and long-term supply agreements. Drive co-development initiatives and lead strategic contract negotiations to embed SiC into customer packaging design flows while monitoring competitor activities and market trends to shape growth strategy. Work closely with materials and engineering teams to align initiatives with SiC process capabilities. Based in the San Francisco Bay Area or Phoenix, Arizona, this role requires a 10+ year track record in semiconductor business development and global travel.
Required Qualifications
- Bachelor's degree in Electrical Engineering, Materials Science, or related technical field
- 10+ years of experience in business development, strategic partnerships, or sales within advanced semiconductor packaging, materials, or the semiconductor supply chain
- Strong understanding of advanced packaging architectures (2.5D/3D, CoWoS, EMIB, Foveros, chiplet integration), interconnect technologies (TSV, TSiCV, RDL, hybrid bonding), and thermal management constraints in AI/HPC systems
- Ability to communicate SiC's technical value proposition (thermal conductivity, mechanical robustness, RF performance) to both engineering and executive audiences at foundries, OSATs, and chip designers
- Proven track record in securing strategic deals, joint development programs, or long-term supply agreements with global semiconductor customers
- Exceptional negotiation, communication, and executive relationship-building skills
- Willingness to travel globally
- Experience developing strategic account plans for key accounts consistent with business unit strategies
- Ability to qualify opportunities and determine fit for SiC packaging materials across the AI chip supply chain
Desired Qualifications
- Passion for building breakthrough growth in an emerging, technically complex market
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