BGA WB Process Technician
On-siteKuala Lumpur, Kuala Lumpur, Malaysia
Job Summary
Perform machine setup, conversion, and qualification for wire bond equipment while monitoring daily production performance and ensuring compliance with process specifications. Execute lot buy-off and process verification before production release, conduct routine audits and inspections, and analyze process data to identify trends affecting quality or yield. Troubleshoot wire bond defects and support engineers for root cause analysis, alongside performing process characterization and parameter optimization activities. Assist in cost reduction and productivity enhancement initiatives. This role is part of NXP Semiconductors' automotive, industrial, and IoT solutions team.
Required Qualifications
- machine setup, conversion, and qualification for wire bond equipment
- Monitor daily production performance
- ensure compliance with process specifications
- Support production activities to achieve output, quality, and delivery targets
- Perform lot buy-off and process verification before production release
- Monitor critical wire bond parameters
- maintain process stability
- Conduct routine process audits and inspections
- Perform process characterization and parameter optimization activities
- Analyze process data
- identify trends affecting quality or yield
- Troubleshoot wire bond defects
- supports engineers for root cause analysis
- Support cost reduction and productivity enhancement initiatives
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