NXP Semiconductors logo
NXP SemiconductorsPosted 1 week ago

BGA WB PRocess Techinician

On-siteKuala Lumpur, Kuala Lumpur, Malaysia

Full TimeEnterprise

Job Summary

Perform machine setup, conversion, and qualification for wire bond equipment while monitoring daily production performance and ensuring compliance with process specifications. Support production activities to achieve output, quality, and delivery targets by performing lot buy-off and process verification before production release. Monitor critical wire bond parameters, conduct routine process audits and inspections, and analyze process data to identify trends affecting quality or yield. Troubleshoot wire bond defects and support engineers for root cause analysis while executing process characterization and parameter optimization activities to support cost reduction and productivity enhancement initiatives.

Required Qualifications

  • Machine setup, conversion, and qualification for wire bond equipment
  • Monitor daily production performance
  • Ensure compliance with process specifications
  • Support production activities to achieve output, quality, and delivery targets
  • Perform lot buy-off and process verification before production release
  • Monitor critical wire bond parameters
  • Maintain process stability
  • Conduct routine process audits and inspections
  • Perform process characterization and parameter optimization activities
  • Analyze process data
  • Identify trends affecting quality or yield
  • Troubleshoot wire bond defects
  • Support engineers for root cause analysis
  • Support cost reduction and productivity enhancement initiatives

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