Backend Process Engineer
$100,000–$135,000 year
On-site · Alhambra, California, United States
Job Summary
The Backend Process Engineer is responsible for the development, optimization, and support of backend wafer fabrication processes for InP-based photonic devices. Responsibilities include owning and optimizing processes such as lapping/thinning, n-side metallization, and rapid thermal annealing (RTA); maintaining AOI processes for defect detection; supporting singulation and packaging interfaces; and collaborating on new product introductions and process transfers. Candidates must have a Bachelor's degree in a relevant field, at least 3 years of experience in semiconductor processing, and strong skills in yield analysis, data-driven process improvement, and SPC.
Required Qualifications
- Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field
- Minimum of 3+ years of experience in backend semiconductor processing
- Hands-on experience with lapping/thinning, metallization, and thermal processes
- Understanding of InP-based or III-V compound semiconductor wafer fabrication processes
- Experience with AOI systems, yield analysis, and data-driven process improvement
- Strong understanding of singulation, packaging interfaces, and reliability requirements
- Proficiency in SPC, DOE, and statistical analysis
- Ability to work across cross-functional manufacturing and engineering teams
Desired Qualifications
- Preferred experience with InP or III-V optoelectronic devices
- Familiarity with AR/HR optical coating processes
- Experience supporting high-mix, low-volume manufacturing environments
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