Assembly Engineer
Hybrid · Cambridge, England, United Kingdom
Job Summary
We’re seeking an Assembly Engineer to drive assembly and packaging activities for RF semiconductor products from prototype through volume production. You will collaborate with design, test, operations, suppliers, and manufacturing partners to deliver robust packaging solutions, improve yield, coordinate reliability testing and qualification, and create/maintain assembly documentation and manufacturing specifications. The role emphasizes hands-on execution across prototype and production builds, process development with OSATs, manufacturability optimisation, and continuous improvement across quality, cost, and production efficiency. Benefits include competitive salary, pension, share option scheme, generous holidays, flexible hours, and remote work options.
Required Qualifications
- Degree in Electronic Engineering, Materials Science, Manufacturing Engineering, or similar
- Experience in semiconductor assembly, packaging, or manufacturing engineering
- Understanding of semiconductor packaging and assembly processes
- Familiarity with OSATs and outsourced semiconductor manufacturing
- Experience with yield improvement, failure analysis, and process optimisation
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