APEC Application Development Engineer – Tyvek® Consumer & Industrial
On-siteMarina Bay, Singapore or Taipei, Taiwan, Taiwan
Job Summary
Act as the primary technical interface for semiconductor customers across Taiwan and the APAC region, driving the development of new Tyvek® applications in interleafing and active packaging. Lead technical discussions, application reviews, and qualification activities with wafer manufacturers, OSATs, and equipment suppliers while serving as the internal subject matter expert for contamination control, ESD management, and material handling. Identify unmet customer needs to translate them into application concepts and support commercialization through test planning, data analysis, and performance validation. Collaborate with global R&D, Product Management, and Manufacturing teams to optimize solutions for advanced packaging and chiplet architectures. Travel up to 30% to support field activities and customer engagements.
Required Qualifications
- Master's degree in Electronic Engineering, Physics, Material Science, Chemical Engineering, or a related field
- Minimum 5 years of experience in semiconductor materials, packaging materials, wafer handling, contamination control, semiconductor packaging, substrate manufacturing, or related applications
- Proven experience working directly with semiconductor customers in technical development, process engineering, application engineering, or product development roles
- Experience supporting cleanroom manufacturing environments
- Experience leading customer-facing technical projects from concept through commercialization
- Ability to travel up to 20%-30%
Desired Qualifications
- Experience with semiconductor interleafing, wafer separators, IC substrate packaging, desiccants, cleanroom packaging, ESD packaging, or contamination-control materials
- Familiarity with semiconductor ecosystem companies such as foundries, memory makers, OSATs, substrate manufacturers, and packaging converters
- Knowledge of wafer fabrication, advanced packaging, chiplet architectures, AI/HPC supply chains, or semiconductor logistics
- Experience with material qualification and semiconductor quality requirements
- Strong analytical, creative, and conceptual thinking skills
- Results-driven mindset
- Excellent communication skills (written and oral) in English
- Self-starter with proactive attitude and ability to work independently
- Strong presentation and stakeholder engagement skills
- Proficiency in MS Office (Word, Excel, PowerPoint, Outlook)
- Willingness to learn and continuously develop technical expertise
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