AI Research Engineer/Scientist
$170,500–$240,710 year
HybridSanta Clara, California, United States
Job Summary
Define architectures and designs that meet specifications and performance targets for next-generation optical interconnects. Optimize core integrated circuit electro-optical components and develop simulation methodologies for scalable electro-photonic systems. Collaborate with cross-functional teams to lead overall project development, design digital and mixed-signal accelerators, and advise on test plans for post-silicon characterization. Thoroughly document all design work with review materials and detailed design descriptions. This role joins the Corporate Technology Office Team to advance datacenter connectivity and scalable AI system design.
Required Qualifications
- Ph.D. in Electrical and Computer Engineering, Optics and Optical Engineering
- Track record of peer-reviewed publications and/or patents in the simulation, design, optimization and implementation of heterogeneously integrated electro-optical devices, as well as Electronic-Photonic ICs
- At least 3 years of experience in digital and mixed-signal design flows with proven track record of successful tapeouts
- Excellent oral and written communication skills
Desired Qualifications
- Strong proficiency with electronic and photonic integrated circuit (EIC and PIC) design CAD tools
- Extensive design experience using hardware description languages (Verilog, Verilog-A) and high-level programming languages (C/C++, python)
- Deep expertise in the design and optimization of active and passive optoelectronic modulators
- Knowledgeable in 2.5D/3D packaging and integration techniques
- Familiarity with switch fabric architectures and related routing algorithms
- Hands-on experience in laboratory testing and characterization of integrated circuits
- Solid understanding of high-speed analog circuitry, including transimpedance amplifiers (TIAs) and modulator drivers
- Proven experience of building end-to-end simulation frameworks bridging electronics, photonics and packaging
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