先端半導体パッケージ設計・開発リーダー / Advanced Semiconductor Package Design & Development Leader
On-siteKodaira, Tokyo, Japan
Kodaira, Tokyo, JapanOn-siteFull TimeSemiconductorsEnterprise
Full TimeEnterpriseSemiconductors
Job Summary
Lead FCBGA package design, develop core technologies, and design boards for FCBGA package mounting. Architect and conceptualize device and system modules utilizing chiplets, while leading interposer designs that meet interface and power supply requirements. Conduct SI/PI simulations and structural simulations, coordinate technical adjustments with design engineers, and perform design reviews. Manage package structure design and verification, and ensure specifications for communication and DRAM interfaces. Collaborate across semiconductor architecture, layout, and board design teams to enable next-generation automotive SoCs.
Required Qualifications
- Experience in semiconductor package design and/or PCB (board) design
- Experience in communication interface and/or DRAM interface circuit design
- Experience in SI/PI (Signal Integrity / Power Integrity) verification
- Experience in chiplet-based design
- Experience in package structure design and verification
- Experience in board-level circuit design
- Experience in power delivery / power supply design
- Comfortable conducting technical discussions and specification reviews in English
Desired Qualifications
- Experience in FCBGA package design
- Development of core technologies
- Design of boards for FCBGA package mounting
- Architectural and conceptual design of devices and system modules utilizing chiplets
- Leading the design of interposers that meet interface and power supply requirements
- Technical coordination with design engineers and conducting design reviews
- Experience in FCBGA packages
- Advanced packages, including Chiplet packages
- Package-mounted system boards
- Bump peripheral regions in semiconductor layout design
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