Advanced Packaging Senior Engineer
$152,700–$203,600 year
On-site · Bucharest, București, Romania
Job Summary
Senior Packaging Engineer role focusing on evaluating design feasibility and physically implementing advanced semiconductor package designs. Responsibilities include close interaction with electrical simulation, operations, and fabrication teams to meet design-for-manufacturing requirements, plus tasks such as tool evaluations, flow development, and library maintenance. Required skills include familiarity with IC package/PCB layout tools (Cadence APD, Xpedition), advanced 2.5D/3D packaging technologies (CoWoS, EMIB, CPO, CPC), flip-chip packaging experience, interpretation of IR drop and S-parameter data, and strong communication in English. The position is based in Bucharest, Romania, and includes base pay in the range of 152,700 to 203,600 USD per year with standard compensation and benefits. The employer emphasizes fair hiring practices and export-control considerations.
Required Qualifications
- Bachelor’s degree in Electrical Engineering
- 3 - 5 years of related professional experience or Master’s/PhD with 1-3 years of experience
- Familiarity with IC package or PCB layout tools (Cadence APD, Xpedition Package Designer)
- Familiarity with packaging technologies and package substrate design rules and assembly rules
- Understanding of 2.5D/3D packaging technologies including CoWoS-S/R/L, EMIB, CPO, CPC
- Hands-on design experience on flip chip packages, 2.5D or 3D is a plus
- Ability to interpret electrical simulation results (IR Drop, S-parameter data) and perform basic checks
- Good English (spoken and written)
- Ability to organize work to meet milestones and collaborate in a team
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