Advanced Packaging Lithography Development Manager
$155,520–$298,440 year
On-siteHillsboro, Oregon, United States
Job Summary
Lead and manage a team of process engineers while driving lithography module development for Foveros Direct technologies. Formulate long-term process roadmaps, develop project schedules, and track milestones to ensure timely feedback between cross-functional teams. Execute yield improvement initiatives and defect reduction programs, partnering with process integration and manufacturing operations to achieve seamless technology transfer to high-volume manufacturing. Maintain deep technical involvement in patterning flow definition and process development, fostering talent development and driving innovation within the etch team. This role supports Intel's industry-leading advanced packaging portfolio for next-generation computing solutions.
Required Qualifications
- Master or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field
- 6+ years of relevant experience with a master's degree
- 5+ years or experience with a PhD degree
- Deep expertise with scanner/stepper systems (ASML, Canon, Nikon) and/or track equipment
- Extensive experience in lithography process optimization, yield enhancement, and/or manufacturing readiness
- Project management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations
- Excellent communication and collaboration skills to drive complex projects across diverse teams and stakeholders
- Strategic mindset with a proven ability to solve complex technical challenges and implement process improvements to achieve business objectives
- Must be able to lift 50 lbs
Desired Qualifications
- Demonstrated ability to build and lead effective teams, including fostering an inclusive, productive, and innovative team culture
- Experience with vendor relations, including material quality assessments and performance management
- Strong knowledge of Design of Experiments (DOE) principles, problem-solving methodologies, and package interconnect technologies
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