Advanced Packaging Electrical / Signal Integrity Architect (f/m/d)
On-siteAachen, North Rhine-Westphalia, Germany
Job Summary
Own the electrical characterization and signoff of advanced semiconductor packages, including developing equivalent circuit models, leading signal and power integrity analysis, and translating high-speed interconnect requirements into optimized architectures. Build and validate package-level electrical models for 2.5D/3D, interposer, and chiplet-based designs while defining stack-ups, routing guidelines, and bump-map strategies from an electrical performance perspective. Support chip-package-board co-simulation and end-to-end channel budgeting in collaboration with ASIC, SerDes, and system engineering teams. Collaborate with OSAT and foundry partners throughout package development and manufacturing to ensure robust electrical performance and design-for-manufacturing compliance.
Required Qualifications
- Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, Physics, or a related technical field, or equivalent experience
- 6+ years of experience in package or PCB signal integrity, power integrity, high-speed interconnect design, advanced packaging, or closely related hardware engineering roles
- Strong expertise in transmission line theory, electromagnetics, S-parameters, channel modeling, package equivalent electrical model development, and signal/power integrity analysis
- Hands-on experience with SI/PI simulation and modeling tools such as Ansys HFSS/SIwave, Cadence Sigrity, Keysight ADS, HSPICE, or equivalent
- Experience developing, validating, and correlating simulation models with laboratory measurements using VNA, TDR, high-speed oscilloscopes, or similar instrumentation
- Working knowledge of advanced packaging technologies including 2.5D/3D integration, interposers, fan-out packaging, chiplets, and high-density substrates, with the ability to collaborate across ASIC, SerDes, package, mechanical, thermal, and manufacturing engineering teams
Desired Qualifications
- Experience with scripting and automation using Python, Perl, Tcl, Cadence SKILL, or similar languages for simulation workflows, data processing, and analysis
- Experience working with OSAT partners on package electrical qualification, advanced package manufacturing, or design-for-manufacturing (DFM) activities
- Experience with electrical/optical co-packaging (EIC-to-PIC interfaces and bump-map signoff), UCIe-class high-speed interconnects, or participation in industry standards organizations such as IEEE, OIF, or JEDEC
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