Advanced Packaging Development Engineer
$127,100–$203,400 year
On-site · Irvine, California, United States
Job Summary
Develop and enable advanced packaging technology to integrate memory dies and SoC dies into one package for AI-related products. Define the packaging technology roadmap for 3–5 years; support development of key components (HBM, iVR, Si Cap) for advanced packaging; manage reliability tests to qualify new technology; lead yield improvement activities for new technology ramp-up. Requires extensive experience in 2.5D/3D and HBM technology development and reliability/yield improvements, plus strong project-management and teamwork abilities. An MS degree in a related engineering field with at least 10 years post-degree experience (or 7 years with a Ph.D.) is required.
Required Qualifications
- MS in related engineering field
- at least 10 years (post degree) of direct experience (or 7 years with a Ph.D. degree)
- 2.5D/3D and HBM technology development and reliability/yield improvements
- project management and teamwork skills
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