7096 - Product Development Engineer
On-site · Lehi, Utah, United States
Job Summary
Product Development Engineer will own end-to-end process integration and device optimization for 28nm CMOS technology, driving yield improvements and leading technology transfer from development to high-volume manufacturing. The role requires refining 28nm CMOS process flows across FEOL/BEOL, optimizing transistor performance, variability, and reliability, and collaborating with design, device, and fab teams to meet performance targets. You will analyze electrical test data, inline metrics, and defectivity trends to drive yield improvements through root cause analysis and corrective actions, correlate parametric data to process variations, and support the transition to high-volume manufacturing by defining process windows, control plans, and production specs. Additional responsibilities include cross-functional collaboration with design, modeling, and reliability teams; contributing to DTCO/STCO efforts for performance and scaling; supporting failure analysis and long-term reliability improvements. Ideal backgrounds include Process Integration Engineer (CMOS/Logic), Device Engineer with strong fab interaction, or Yield/Product Engineer with deep process understanding. The role is located in Lehi, UT.
Required Qualifications
- BS/MS/PhD in Electrical Engineering, Materials Science, Physics, or related field
- ~5–12 years of experience in semiconductor process development or integration
- Strong background in CMOS technology (≤28nm preferred)
- Process integration (FEOL, HKMG, silicidation, or BEOL)
- Device physics and electrical characterization
- Experience with Yield analysis, DOE, SPC, and failure analysis
- TCAD or electrical simulation tools (a plus)
- Ability to work cross-functionally in a fast-paced fab environment
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