3D IC and ADVANCED PACKAGING CAD ENGINEER
HybridMarkham, Ontario, Canada
Job Summary
Implement and maintain 3D-IC and advanced packaging design flows from RTL through signoff. Develop and integrate end-to-end AI capabilities into CAD flows, including ML-based optimization, predictive modeling, and LLM-assisted automation. Build and deploy agentic AI systems that automate multi-step design and verification tasks. Partner with EDA vendors on feature requirements and AI co-development opportunities. Define strategy to ensure flows meet future design requirements and advanced technology nodes. Regress methodology and analyze results to improve quality of results. Work with design and CAD teams to deliver tools meeting key QoR metrics for timing, area, and performance.
Required Qualifications
- Bachelors or Masters degree in computer engineering/Electrical Engineering
- Strong experience in 3D-IC design and advanced packaging technologies
- Hands-on experience with Synopsys 3DIC Compiler and related EDA toolchains
- Strong understanding of EDA tools from Synopsys and Cadence
- Demonstrated experience applying AI to CAD, EDA, or hardware design problems
- Experience building or working with LLM-based tools, agentic AI frameworks, or AI-assisted automation pipelines
- Strong scripting skills in Python, TCL, and Perl in a Linux/Unix environment
- Experience with Verilog, RTL, and UPF for multi-clock domain and low power designs
- Familiarity with distributed and cloud compute environments for flow automation
- Excellent verbal and written communication skills
- Must be able to lift 50 lbs
Desired Qualifications
- Strong experience in 3D-IC design and advanced packaging technologies
- Hands-on experience with Synopsys 3DIC Compiler and related EDA toolchains
- Strong understanding of EDA tools from Synopsys and Cadence
- Demonstrated experience applying AI to CAD, EDA, or hardware design problems
- Experience building or working with LLM-based tools, agentic AI frameworks, or AI-assisted automation pipelines
- Strong scripting skills in Python, TCL, and Perl in a Linux/Unix environment
- Experience with Verilog, RTL, and UPF for multi-clock domain and low power designs
- Familiarity with distributed and cloud compute environments for flow automation
- Excellent verbal and written communication skills
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